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SK hynix is set to showcase its innovative AI memory technologies at CES 2025, highlighting its role as a 'Full Stack AI Memory Provider.' The company will present a variety of products, including HBM and next-gen memories like PIM, aimed at enhancing AI infrastructure. This participation underscores SK hynix's commitment to technological innovation and providing significant value in the AI era.
The exhibition will feature high-capacity enterprise SSDs and on-device AI products, demonstrating advancements in data processing speed and power efficiency. Notably, SK hynix will collaborate with SK Telecom, SKC, and SK Enmove to illustrate how their AI infrastructure is transforming industries. The CEO emphasized the importance of adapting to the accelerating changes driven by AI, with plans to produce 6th generation HBM later this year.
• SK hynix introduces advanced AI memory technologies at CES 2025.
• The company aims to lead the customized HBM market with new products.
This term refers to a comprehensive provider of AI-related memory products and technologies.
PIM technology enhances data processing capabilities by integrating processing functions within memory modules.
HBM is a high-performance memory interface designed to meet the demands of AI and data-intensive applications.
SK hynix is a leading semiconductor company focused on developing advanced memory solutions for AI applications.
Solidigm, a subsidiary of SK hynix, specializes in high-capacity SSDs that cater to AI data center needs.
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