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SiMa Technologies Inc. has introduced the MLSoC Modalix, a groundbreaking system-on-chip designed for multimodal AI workloads at the embedded edge. This chip aims to enhance AI performance in industrial robots and edge computing devices, significantly reducing latency. It supports various AI models, including large language models and convolutional neural networks, enabling more complex applications.
The MLSoC Modalix is available in multiple configurations, offering up to 200 TOPS of performance, which translates to trillions of computations per second. Built on a six-nanometer process, it integrates advanced processing units and memory capabilities, allowing for real-time data access. This innovation is set to revolutionize applications in autonomous vehicles, drones, and healthcare, showcasing SiMa.ai's commitment to advancing edge AI technology.
• SiMa.ai launches first system-on-chip for multimodal AI at the edge.
• MLSoC Modalix supports various AI models, enhancing edge computing capabilities.
The MLSoC Modalix chip is specifically designed to handle these complex multimodal applications efficiently.
The MLSoC Modalix offers configurations ranging from 25 to 200 TOPS, showcasing its high processing capabilities.
The MLSoC Modalix supports CNNs, enabling advanced visual recognition capabilities in edge devices.
is an AI chip startup focused on developing advanced hardware for edge AI applications. The launch of the MLSoC Modalix positions the company as a leader in multimodal AI processing at the edge.
(TSMC) is a leading semiconductor manufacturer known for its advanced chip fabrication technologies. The MLSoC Modalix is built on TSMC's six-nanometer process, highlighting the collaboration between the two companies.
The MLSoC Modalix supports OpenAI's models, showcasing its capability to handle sophisticated AI workloads.
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