CPO promises to have presence in semiconductor advanced packaging

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CPO promises to have presence in semiconductor advanced packaging

The article discusses how the AI boom is propelling advancements in chipmaking, with Co-Packaged Optics (CPO) aiming to establish itself as a preferred semiconductor packaging technology alongside CoWoS. This indicates a shift towards innovative packaging solutions driven by the demands of artificial intelligence technologies.

As the semiconductor industry evolves, the focus on advanced packaging technologies like CPO highlights the importance of efficient and high-performance packaging solutions to meet the growing demands of AI applications. This development signifies a strategic move by CPO to position itself as a key player in the semiconductor packaging landscape, catering to the needs of emerging technologies.

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