MWC 2025 Day 1: World’s THINNEST Phone, Lenovo’s AI ThinkPad…TOP 5 Tech At Mobile World Congress

Lenovo unveiled its innovative ThinkBook Flip AI concept, featuring an AI-enhanced OLED display that supports multiple productivity modes. Intel showcased the Geon 6 chip, which revolutionizes network infrastructure with integrated AI acceleration, improving performance and efficiency. Xiaomi introduced the 15 Ultra smartphone, boasting a 200 MP camera and AI-driven optimizations, while Tecno's Spark Slim emphasizes sleek design with robust battery life and AI features. Samsung presented new foldable concepts aimed at improving user experience in gaming and daily functionality, showcasing the potential future of foldable technology and AI integration.

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