Realtek

The high-speed ethernet (HSE) industry is undergoing an unprecedented boom, and we only need two letters to explain why: AI.

"RAM is proud to introduce the Medusa™ Array family of products to meet the growing photonic interface need in AI and DC infrastructure," said John Marciante, CEO of RAM Photonics. "Our automated manufacturing platform ensures unmatched precision and industry record yields, positioning RAM as a leader in high-volume fiber interconnects."

MediaTek has introduced its Genio 720 and Genio 520, a new generation of edge AI IoT platforms. Built on an 8th generation MediaTek NPU, these chips enable on-device generative artificial intelligence across diverse IoT applications.

Broadcom's share price rose by as much as 14% in extended trading, after the firm reported healthy demand for its custom AI chips.

TCL, a pioneer in display across feature-rich smartphones, tablets, and connected devices, today reaffirmed its commitment to 'Connect the Unconnected, Inspire Smarter Connections' in the realm of smart connected devices.

VVDN Technologies, a global provider of Software, Product Engineering and Electronics Manufacturing services and Solution, has announced a collaboration with Qualcomm Technologies, Inc. to introduce its next-generation Wi-Fi 7 Access Point Reference Design.

Solidigm extends deal with Broadcom to use high-capacity SSD controllers for AI and data-intensive workloads. Broadcom stock surged 92% in the last 12 months.

Artificial Intelligence (AI) is rapidly transforming industries, enabling innovations in areas such as autonomous vehicles, smart cities, and advanced